Thermal management of electronic equipment utilizing heat pipes. A gateway review

The growing power density and miniaturization of electronic equipment make thermal management critical to ensure reliability and performance. Among the passive methodologies, heat pipes are a relevant option thanks to their high equivalent thermal conductivity, absence of any moving part, and versatility. The present review offers an overview on the application of heat pipes for thermal management of electronic equipment by analysing the operating principles, the different typologies, and the approaches for the analytical and numerical modelling. Furthermore, strategies for enhancing heat pipe performances are also analysed such as the coupling with phase change materials, nanofluids, and fins. The review highlights how these combinations enhance the performances by notably increasing the thermal dissipation capacity. Finally, a set of practical cases are illustrated where heat pipes are used to cool electronic chips or high heat density consumer electronic devices such as smartphone, tablets, and laptops. Future research directions are also proposed to support the development of more and more compact and efficient heat pipes for high heat density applications.