The problem of dynamic electrothermal equivalent extraction for system level and signal integrity analysis is considered in the framework of standard macromodeling tech- niques. The self-heating and mutual thermal impedances of the embedded elements of the system—preliminarily evaluated via 3-D thermal simulations—are reduced with passive identification methods, and equivalent electrical models are realized with a Foster multiport synthesis scheme. The identification is pursued with a convex optimization approach, which is found to be well suited for the thermal problem. As a case study, the coupled electrothermal analysis of an ultra-thin chip-stacking module including two thinned silicon chips interconnected by a copper line is fully carried out in SPICE.
Dynamic electrothermal macromodeling: An application to signal integrity analysis in highly integrated electronic systems
Massimiliano de Magistris;
2013-01-01
Abstract
The problem of dynamic electrothermal equivalent extraction for system level and signal integrity analysis is considered in the framework of standard macromodeling tech- niques. The self-heating and mutual thermal impedances of the embedded elements of the system—preliminarily evaluated via 3-D thermal simulations—are reduced with passive identification methods, and equivalent electrical models are realized with a Foster multiport synthesis scheme. The identification is pursued with a convex optimization approach, which is found to be well suited for the thermal problem. As a case study, the coupled electrothermal analysis of an ultra-thin chip-stacking module including two thinned silicon chips interconnected by a copper line is fully carried out in SPICE.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
