CINECA IRIS Institutional Research Information System
IRIS è la soluzione IT che facilita la raccolta e la gestione dei dati relativi alle attività e ai prodotti della ricerca. Fornisce a ricercatori, amministratori e valutatori gli strumenti per monitorare i risultati della ricerca, aumentarne la visibilità e allocare in modo efficace le risorse disponibili.
EnglishMainly due to their low weight, low cost and ease of assembly, the adhesive bonds have emerged as a promising technology. However, the lack of adequate tools of design and control remain an obstacle to the use of the adhesives. In this work a cohesive interface model formulated within the framework of damage mechanics is applied for the simulation of decohesion during crack propagation tests. Considering the mechanical tests of aluminium/epoxy specimens, comparisons between experimental and numerical results are presented.
| Titolo: | Numerical simulations of crack propagation tests in adhesive bonded joints | |
| Autori: | ||
| Data di pubblicazione: | 2012 | |
| Rivista: | ||
| Abstract: | Mainly due to their low weight, low cost and ease of assembly, the adhesive bonds have emerged as a promising technology. However, the lack of adequate tools of design and control remain an obstacle to the use of the adhesives. In this work a cohesive interface model formulated within the framework of damage mechanics is applied for the simulation of decohesion during crack propagation tests. Considering the mechanical tests of aluminium/epoxy specimens, comparisons between experimental and numerical results are presented. | |
| Handle: | http://hdl.handle.net/11367/18192 | |
| Appare nelle tipologie: | 1.1 Articolo in rivista |
File in questo prodotto:
http://hdl.handle.net/11367/18192
Copyright © 2021